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LM5111 Datasheet(PDF) 15 Page - Texas Instruments |
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LM5111 Datasheet(HTML) 15 Page - Texas Instruments |
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15 / 30 page ![]() VHIGH Q2 VGATE RG Q1 VTRIG CIN 15 LM5111 www.ti.com SNVS300H – JULY 2004 – REVISED SEPTEMBER 2016 Product Folder Links: LM5111 Submit Documentation Feedback Copyright © 2004–2016, Texas Instruments Incorporated Thermal Considerations (continued) Figure 16. Driver Output Stage and Load The schematic above shows a conceptual diagram of the LM5111 output and MOSFET load. Q1 and Q2 are the switches within the gate driver. RG is the gate resistance of the external MOSFET, and CIN is the equivalent gate capacitance of the MOSFET. The gate resistance Rg is usually very small and losses in it can be neglected. The equivalent gate capacitance is a difficult parameter to measure since it is the combination of CGS (gate to source capacitance) and CGD (gate to drain capacitance). Both of these MOSFET capacitances are not constants and vary with the gate and drain voltage. The better way of quantifying gate capacitance is the total gate charge QG in coulombs. QG combines the charge required by CGS and CGD for a given gate drive voltage VGATE. Assuming negligible gate resistance, the total power dissipated in the MOSFET driver due to gate charge is approximated by PDRIVER = VGATE × QG × FSW where • FSW = switching frequency of the MOSFET (2) For example, consider the MOSFET MTD6N15 whose gate charge specified as 30 nC for VGATE = 12 V. The power dissipation in the driver due to charging and discharging of MOSFET gate capacitances at switching frequency of 300 kHz and VGATE of 12 V is equal to PDRIVER = 12 V × 30 nC × 300 kHz = 0.108 W. (3) If both channels of the LM5111 are operating at equal frequency with equivalent loads, the total losses will be twice as this value which is 0.216 W. In addition to the above gate charge power dissipation, transient power is dissipated in the driver during output transitions. When either output of the LM5111 changes state, current will flow from VCC to VEE for a very brief interval of time through the output totem-pole N and P channel MOSFETs. The final component of power dissipation in the driver is the power associated with the quiescent bias current consumed by the driver input stage and Under-voltage lockout sections. Characterization of the LM5111 provides accurate estimates of the transient and quiescent power dissipation components. At 300-kHz switching frequency and 30-nC load used in the example, the transient power will be 8 mW. The 1-mA nominal quiescent current and 12-V VGATE supply produce a 12-mW typical quiescent power. Therefore the total power dissipation PD = 0.216 + 0.008 + 0.012 = 0.236 W. (4) We know that the junction temperature is given by TJ = PD × θJA + TA (5) |
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