OUT A

1

2

3

4

5

6

7

8

NC

IN_A

VEE

IN_B

NC

VCC

OUT_B

3

LM5111

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SNVS300H – JULY 2004 – REVISED SEPTEMBER 2016

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5 Device Options

Table 1. Configuration Table

PART NUMBER

"A" OUTPUT CONFIGURATION

"B" OUTPUT CONFIGURATION

PACKAGE

LM5111-1M/-1MX/-1MY/-1MYX

Noninverting (Low in UVLO)

Noninverting (Low in UVLO)

SOIC, MSOP-PowerPAD

LM5111-2M/-2MX/-2MY/-2MYX

Inverting (Low in UVLO)

Inverting (Low in UVLO)

SOIC, MSOP-PowerPAD

LM5111-3M/-3MX/-3MY/-3MYX

Inverting (Low in UVLO)

Noninverting (Low in UVLO)

SOIC, MSOP-PowerPAD

LM5111-4M/-4MX/-4MY/-4MYX

Inverting (High in UVLO)

Noninverting (Low in UVLO)

SOIC, MSOP-PowerPAD

(1)

Only available with the MSOP-PowerPAD package.

6 Pin Configuration and Functions

D and DGN Package

8-Pin SOIC and MSOP-PowerPAD

Top View

Pin Functions

PIN

I/O

DESCRIPTION

NAME

NO.

IN_A

2

I

‘A’ side control input. TTL compatible thresholds.

IN_B

4

I

‘B’ side control input. TTL compatible thresholds.

OUT_A.

7

O

Output for the ‘A’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is

capable of sourcing 3 A and sinking 5 A.

OUT_B

5

O

Output for the ‘B’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is

capable of sourcing 3 A and sinking 5 A.

VCC

6

—

Positive output supply. Locally decouple to VEE.

VEE

3

—

Ground reference for both inputs and outputs. Connect to power ground.

NC

1, 8

—

No Connection

Exposed Pad(1)

—

It is recommended that the exposed pad on the bottom of the package be soldered to ground plane on

the PC board to aid thermal dissipation.