5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2) (3)

MIN

MAX

UNIT

VDD

–0.5

6

V

A0, A1, A2, SCL, SDA, RST

(Collectively called digital pins)

6

V

Voltage on LED pins

VSS − 0.5

6

V

Junction temperature

150

°C

Power dissipation(4)

400

mW

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

The part cannot dissipate more than 400 mW.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

Machine model

±200

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1) (2)

MIN

NOM

MAX

UNIT

VDD

2.3

5.5

V

Junction temperature

–40

125

°C

Operating ambient temperature

–40

85

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device might occur. Recommended Operating Conditions are

conditions under which operation of the device is ensured. Recommended Operating Conditions do not imply ensured performance

limits. For verified performance limits and associated test conditions, see Section 5.5.

(2)

All voltages are with respect to the potential at the GND pin.

5.4 Thermal Information

THERMAL METRIC(1)

LP3943

UNIT

RTW (WQFN)

24 PINS

RθJA

Junction-to-ambient thermal resistance

45.0

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

41.5

°C/W

RθJB

Junction-to-board thermal resistance

22.4

°C/W

ψJT

Junction-to-top characterization parameter

0.5

°C/W

ψJB

Junction-to-board characterization parameter

22.5

°C/W

LP3943

SNVS256E – NOVEMBER 2003 – REVISED OCTOBER 2024

www.ti.com

4

Submit Document Feedback

Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: LP3943