Data Sheet

ADPA1112

ABSOLUTE MAXIMUM RATINGS

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Rev. 0 | 6 of 21

Table 7. Absolute Maximum Ratings

Parameter

Rating

Bias Voltage

Drain (VDD1 and VDD2)

35V

Gate (VGG1)

−8.0V DC to 0V DC

Bias Current

Gate Current (IGG1) at 85°C

7.2mA (see Figure 51)

RF Input Power (RFIN)

33 dBm

Continuous Power Dissipation (PDISS),

TCASE = 85°C, Derate 407mW/°C Above 85°C

56.9W

Temperature

Nominal Peak Channel, TCASE = 85°C,

PIN = 28dBm, PDISS = 50.0W at 20GHz

208.0°C

Storage Range

−55°C to +150°C

Operating Range

−40°C to +85°C

Maximum Channel

225°C

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJC is the channel to case thermal resistance where the case is the

bottom of the package base.

Table 8. Thermal Resistance

Package Type

θJC1

Unit

EJ-14-1

2.46

°C/W

1 θJC was determined by simulation under the following conditions: the heat

transfer is due solely to thermal conduction from the channel through the

package base to the heatsink. The bottom of the package base is held

constant at the operating temperature of 85°C.

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD

sensitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

ESD Ratings for ADPA1112

Table 9. ADPA1112, 14-Lead LDCC

ESD Model

Withstand Threshold (V)

Class

HBM

±500

1B

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.