MP6005

– WIDE-INPUT, HIGH-EFFICIENCY FLYBACK AND FORWARD CONTROLLER

MP6005 Rev. 1.0

www.MonolithicPower.com

3

2/5/2021

MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.

© 2021 MPS. All Rights Reserved.

PIN FUNCTIONS

Pin #

Name

Pin Function

1

VCC

Internal circuit supply pin. The VCC pin is powered by the internal LDO regulator

(LDO) from the VIN pin. To bypass the internal regulator, connect a capacitor from the

VCC pin to GND. The VCC capacitor has a 1µF minimum for flyback application, and a

4.7µF minimum for forward application. The VCC pin can also be powered by an

external power source to reduce internal low-dropout loss.

2

SENSE

Current-sense PSR, output voltage (VOUT) compensation, and frequency dithering

setting pin. For function details, see the Output Voltage Compensation section and the

Frequency Dithering section on page 17.

3

EN

On/off control pin. The EN pin is internally connected to GND through a 2.5

MΩ resistor.

4

VIN

Input power supply pin. Connect a bypass capacitor from the VIN pin to GND.

5

MODE

PSR/SSR mode and dead time setting pin. For function details, see the Work Mode

Detection section on page 15.

6

COMP

Loop compensation pin. In PSR mode, the COMP pin is the error amplifier (EA) output.

In SSR mode, the COMP pin is pulled up to 5V through an internal 10kΩ resistor.

7

FB

Output voltage feedback and OVP monitoring pin. To regulate the output voltage in

PSR mode, connect the FB pin to a resistor divider from the SENSE pin. The internal EA

is disabled in SSR mode. The FB pin detects the OVP signal in both PSR and SSR

mode. If OVP is not used in SSR mode, connect the FB pin to GND.

8

GND

Ground. Power return for the controller.

9

SYNC

Synchronous MOSFET gate driver pin.

10

GATE

Main MOSFET gate driver pin.

ABSOLUTE MAXIMUM RATINGS (1)

VIN .............................................. -0.3V to +100V

VCC, VGATE, VSYNC.......................... -0.3V to +18V

VEN .......................................... -0.3V to +6.5V (2)

VFB .......................................... -0.5V to +5.5V (3)

All other pins ............................... -0.3V to +5.5V

EN sinking current .............................. 0.5mA (2)

FB sinking current ............................... ±2mA (3)

Continuous power dissipation (TA = +25°C) (4) (6)

MSOP10 .................................................. 1.62W

Junction temperature ................................150°C

Lead temperature .....................................260°C

Storage temperature ................ -65°C to +150°C

Recommended Operating Conditions (5)

Supply voltage (VIN) ...........................8V to 80V

Maximum VCC, GATE, SYNC voltage ........ 16V

Maximum EN sink current ....................0.4mA (2)

Maximum FB sink current .....................±1mA (3)

Operating junction temp (TJ) ... -40 °C to +125°C

Thermal Resistance

θJA

θJC

MSOP10

EV6005-K-00A (6) ................ 77....... 17

… °C/W

JESD51-7 (7) ...................... 150...... 65

… °C/W

Notes:

1) Exceeding these ratings may damage the device.

2) When VEN is pulled high, a current limited by the external pull-

up resistor flows into the EN pin. See the Enable (EN) Control

section on page 15 for the EN pin

’s voltage rating description.

3) FB is clamped by the internal circuit. The sink and source

currents should be limited. See the Setting the Output Voltage

section on page 20 for details.

4) The maximum allowable power dissipation is a function of the

maximum junction temperature TJ (MAX), the junction-to-

ambient thermal resistance θ

JA, and the ambient temperature

TA. The maximum allowable continuous power dissipation at

any ambient temperature is calculated by PD (MAX) = (TJ

(MAX) - TA) / θJA. Exceeding the maximum allowable power

dissipation can cause excessive die temperature, and the

regulator may go into thermal shutdown. Internal thermal

shutdown circuitry protects the device from permanent

damage.

5) The device is not guaranteed to function outside of its

operating conditions.

6) Measured on EV6005-K-00A, 2-layer 90mmx35mm PCB.

7)

The value of θ

JA given in this table is only valid for comparison

with other packages and cannot be used for design purposes.

These values were calculated in accordance with JESD51-7

and simulated on a specified JEDEC board. They do not

represent the performance obtained in actual application.