5

TPL5010

www.ti.com

SNAS651A – JANUARY 2015 – REVISED SEPTEMBER 2018

Product Folder Links: TPL5010

Submit Documentation Feedback

Copyright © 2015–2018, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The voltage between any two pins should not exceed 6V.

(3)

The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a

printed-circuit board (PCB).

7 Specifications

7.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

–0.3

6

V

Input Voltage at any pin(2)

–0.3

VDD + 0.3

V

Input Current on any pin

–5

+5

mA

Junction Temperature, TJ(3)

150

°C

Storage Temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human Body Model, per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-101(2)

±250

7.3 Recommended Operating Ratings

MIN

MAX

UNIT

Supply Voltage (VDD-GND)

1.8

5.5

V

Temperature

–40

105

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

7.4 Thermal Information

THERMAL METRIC(1)

TPL5010

UNIT

DDC (SOT-23)

6 PINS

RθJA

Junction-to-ambient thermal resistance

163

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

26

°C/W

RθJB

Junction-to-board thermal resistance

57

°C/W

ψJT

Junction-to-top characterization parameter

7.5

°C/W

ψJB

Junction-to-board characterization parameter

57

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W