Preliminary Technical Data

ADD8733

Rev. PrA | Page 7 of 16

ABSOLUTE MAXIMUM RATINGS

Table 8.

Parameter1

Rating

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

TBD

SD_VIN/SD_SW/SD_BS/SD_FB/SD_COMP

to SU_PGND

NCP_REF/NCP_FB/NCP_DRV to NPCP_GND

TBD

PCP_FB/PCP_DRV/NPCP_SUP to NPCP_GND

TBD

GPM_FLK/GPM_CE/GPM_DPM to GND

TBD

GPM_RE/GPM_OUT/GPM_H/GPM_L to GND

TBD

TBD

VC1_POS/VC1_NEG/VC1_OUT/VC2_OUT/VC2_POS/

VC2_NEG to VC1_GND

ESD CAUTION

SU_SW/SU_D/SU_S/SU_FB/SU_COMP to SU_PGND

TBD

VGL_DLY/SU_DLY/SD_SS/SU_SS/VSR_OUT to GND

TBD

Voltage Between SU_PGND, NPCP_GND,

and GND

±0.5

25.88°C/W

Thermal Resistance for Exposed Pad Soldered to

125°C

−40°C to +85°C

−65°C to +150°C

Reflow Peak Temperature (20 sec to 40 sec)

250°C

ground connection.