www.ti.com

EXAMPLE BOARD LAYOUT

.000 PKG

0

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

(

)

0.463

(

)

0.975

(

)

1.475

2X (

)

0.665

2X (

)

1.165

2X (

)

1.665

2X (

)

2.05

2X (

)

0.125

(

)

1.65

(

)

0.975

(

)

1.475

4X (0.25)

(0.275)

8X (0.25)

(0.4) TYP

4X (

)

0.325

4X (

)

1.113

4X (

)

1.9

2X (0.8)

(R0.05) TYP

(R0.05) TYP

(

0.2) TYP

VIA

3X (

)

2.45

(0.3)

2X (0.35)

(0.55)

QFN-FCMOD - 2.05 mm max height

RCJ0009A

PLASTIC QUAD FLATPACK - NO LEAD

4229161/B 04/2023

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

LAND PATTERN EXAMPLE

SCALE: 20X

(45 X 0.19)

1

4

5

6

7

9

METAL UNDER

SOLDER MASK

TYP

SOLDER MASK

OPENING

TYP

METAL EDGE

SOLDER MASK

OPENING

EXPOSED

METAL

NON SOLDER MASK

DEFINED

PADS:1-3 & 7-9

SOLDER MASK DETAILS

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

DEFINED

PADS: 4-6