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L9678P Datasheet(PDF) 190 Page - STMicroelectronics |
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L9678P Datasheet(HTML) 190 Page - STMicroelectronics |
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190 / 215 page  Electrical characteristics L9678P, L9678P-S 190/216 DS11626 Rev 9 11 ILKG_SF_ON SF leakage current Device ON, VRESDIAG = VSSxy = 35 V, SFx = 0V-35 V -50 - 50 µA 12 ILKG_SF_OFF Device OFF, VRESDIAG = open, VSSxy = open but all SSxy pins connected, SEx = 0 V - 35 V -50 - 50 µA 13 ILKG_SR_ON SR leakage current Device ON, VRESDIAG = VSSxy = 35 V, SFx = 0V-35 V - - 50 µA 14 ILKG_SR_OFF Device OFF, VRESDIAG = open, VSSxy = open but all SSxy pins connected, SEx = 0 V - 35 V - - 50 µA 15 LDEPL Load Inductance Maximum load inductance Design Information(2) 0 - 60 µH 16 CSFx Load capacitance Maximum capacitance to GND Design Information 13 - 455 nF 17 CSRx 13 - 455 nF 18 CSSxy SSxy capacitance Maximum capacitance to GND connected directly to SSxy pin Design Information - - 10 nF 19 RSFLx Load Impedance Design Information - - 6.5 Ω 20 - Wire Length Squib/pyroswitch Loops containing a clockspring shall be limited to a maximum length of 3m 1 - 10 m 21 RWirex Wire resistance Design information 16.8 - 63.4 mΩ/m 22 LWirex Wire Inductance Design Information 0.6 - 1.8 µH/m 23 RCSx Clock spring resistance Maximum number of clock springs is 3 for any IC Design Information 0 - 0.7 Ω 24 LCSx Clock spring inductance Design Information 0 - 42.9 µH 25 kL_CS1 – L_CS2 Clocks pring coupling Design Information 0.739 - 0.903 - 26 LEMI Squib/pyroswitch EMI protection Design Information 0 - 7.7 µH 1. In case of an unsupplied device and shorted deployment pins (e.g. to battery voltage), the dynamic reverse current through the high side power stage depends on CSSxy. Table 47. Deployment drivers - DC specifications (continued) N° Symbol Parameter Condition Min. Typ. Max. Unit |
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