7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

6

V

Analog inputs, VIN+, VIN– (2)

Differential (VIN+) – (VIN–)

–80

80

V

Common-mode

–6

90

REF1, REF2, NC inputs

GND – 0.3

VS + 0.3

V

Output

GND – 0.3

VS + 0.3

V

Operating free-air temperature, TA

–55

150

°C

Junction temperature, TJ

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

VIN+ and VIN– are the voltages at the IN+ and IN– pins, respectively.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input voltage

–4

80

V

VS

Operating supply voltage

2.7

5.5

V

TA

Operating free-air temperature

–40

125

°C

7.4 Thermal Information

THERMAL METRIC(1)

INA240

UNIT

PW (TSSOP)

D (SOIC)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

149.1

113.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

33.2

51.9

°C/W

RθJB

Junction-to-board thermal resistance

78.4

57.8

°C/W

ψJT

Junction-to-top characterization parameter

1.5

10.2

°C/W

ψJB

Junction-to-board characterization parameter

76.4

56.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

INA240

SBOS662C – JULY 2016 – REVISED DECEMBER 2021

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