5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range, unless otherwise noted.(1) (2) (3)

MIN

MAX

UNIT

Voltage

Supply

15

V

Input

–0.3

(V+) + 0.3

Output

15

Current

Output

100

mA

Storage temperature, Tstg

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.3.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

See AN-1112 (SNVA009) for DSBGA considerations.

(3)

If military- or aerospace-specified devices are required, contact the TI Sales Office or Distributors for availability and specifications.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1500

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Temperature

LMC555IM

−40

125

°C

LMC555CM, MM, N, TP

−40

85

Maximum allowable power dissipation at

25°C  

PDIP-8

1126

mW

SOIC-8

740

VSSOP-8

555

8-bump DSBGA

568

5.4 Thermal Information

THERMAL METRIC(1)

LMC555

UNIT

D

(SOIC)

DGK

(VSSOP)

P

(PDIP)

YPB

(DSBGA)

8 PINS

8 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

138.9

188.3

93.1

102.3

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

78.8

78.8

82.5

0.9

°C/W

RθJB

Junction-to-board thermal resistance

87.9

110.2

69.6

31.2

°C/W

ψJT

Junction-to-top characterization parameter

23.2

18.5

52.0

0.5

°C/W

ψJB

Junction-to-board characterization parameter

86.9

108.6

69.2

31.2

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

N/A

N/A

°C/W

(1)

For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

LMC555

SNAS558N – JANUARY 2000 – REVISED MARCH 2024

www.ti.com

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