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LMX2572LP Datasheet(PDF) 80 Page - Texas Instruments |
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LMX2572LP Datasheet(HTML) 80 Page - Texas Instruments |
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80 / 83 page  www.ti.com PACKAGE OUTLINE C 40X 0.3 0.2 4.5 0.1 40X 0.5 0.3 1 MAX (0.2) TYP 0.05 0.00 36X 0.5 2X 4.5 2X 4.5 A 6.1 5.9 B 6.1 5.9 0.3 0.2 0.5 0.3 (0.1) VQFN - 1 mm max height RHA0040H PLASTIC QUAD FLATPACK - NO LEAD 4219055/B 08/22/2019 PIN 1 INDEX AREA 0.08 C SEATING PLANE 1 10 21 30 11 20 40 31 (OPTIONAL) PIN 1 ID 0.1 C A B 0.05 EXPOSED THERMAL PAD DETAIL SEE TERMINAL SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 41 SEE SIDE WALL DETAIL SCALE 2.200 DETAIL OPTIONAL TERMINAL TYPICAL SIDE WALL DETAIL OPTIONAL METAL THICKNESS |
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