PCM5142PW datasheet(6/123 Pages) TI2

6 / 123 page

PCM5141, PCM5142

SLAS759B – AUGUST 2012 – REVISED JANUARY 2016

www.ti.com

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVDD, CPVDD, DVDD

–0.3

3.9

Supply voltage

LDO with DVDD at 1.8 V

–0.3

2.25

DVDD at 1.8 V

–0.3

2.25

Digital input voltage

DVDD at 3.3 V

–0.3

3.9

Analog input voltage

–0.3

3.9

Operating junction temperature, TJ

–40

130

°C

Storage temperature, Tstg

–65

150

°C

7.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Electrostatic

V(ESD)

discharge

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VCOM mode

3.3

3.46

AVDD

Analog power supply voltage

Referenced to AGND(1)

VREF mode

3.2

3.3

3.46

1.8 V DVDD

1.65

1.8

1.95

DVDD

Digital power supply voltage

Referenced to DGND(1)

3.3 V DVDD

3.1

3.3

3.46

CPVDD

Charge pump supply voltage

Referenced to CPGND(1)

3.1

3.3

3.46

MCLK

Master clock frequency

MHz

LOL, LOR

Stereo line output load resistance

Ω

CLOUT

Digital output load capacitance

Operating junction temperature

–40

130

°C

(1)

All grounds on board are tied together; they must not differ in voltage by more than 0.2-V maximum, for any combination of ground

signals.

7.4 Thermal Information

PCM512x

THERMAL METRIC(1)

RHB (TSSOP)

UNIT

32 PINS

RθJA

Junction-to-ambient thermal resistance

72.2

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

17.5

°C/W

RθJB

Junction-to-board thermal resistance

35.0

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

34.5

°C/W

(1)

For more information about trdational and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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