6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

Supply voltage

7

V

Signal input pins(2)

–0.5

(VCC) + 0.5

Current

Signal input pins(2)

–10

10

mA

Output short circuit(3)

100

Temperature

Operating

–55

125

°C

Junction, TJ

150

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 6.3.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground.

6.2 ESD Ratings

VALUE

UNIT

V(ESD) Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

Charged-device model (CDM),

per JEDEC specification JESD22-C101(2)

TLV3201

±2000

TLV3202

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VS

Supply voltage, VS = (VS+) – (VS–)

2.7 (±1.35)

5.5 (±2.75)

V

Specified temperature

–40

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

TLV3201

TLV3202

UNIT

DBV

(SOT-23)

DCK

(SC70)

D

(SOIC)

DGK

(VSSOP)

5 PINS

5 PINS

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

237.8

281.9

143.6

201.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

108.7

97.6

97.2

92.5

°C/W

RθJB

Junction-to-board thermal resistance

64.1

68.3

84.2

123.3

°C/W

ψJT

Junction-to-top characterization parameter

12.1

2.6

45.5

23.0

°C/W

ψJB

Junction-to-board characterization parameter

63.3

67.3

83.7

212.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV3201, TLV3202

SBOS561C – MARCH 2012 – REVISED MAY 2024

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