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PACKAGE OUTLINE

4.1

3.9

6.1

5.9

1.9

1.7

0.01

0.00

2X 3

12X 0.5

2X 2.425

.000 PKG

0

2X 1.775

2X 0.975

2X 0.325

2X 0.475

2X 1.125

2X 1.775

2X 2.425

4X

0.675

0.575

22X

0.3

0.2

12X

0.75

0.55

10X

0.6

0.4

2X 1.25 0.1

2X 1.6 0.1

1.925 0.1

0.6 0.1

0.6 0.1

1.925 0.1

2X 1 0.1

2X 0.74 0.1

4X

0.8

0.7

(0.2) TYP

(0.15)

TYP

(0.125) TYP

B0QFN - 1.9 mm max height

RDH0030A

PLASTIC QUAD FLATPACK - NO LEAD

4226150/B 01/2022

0.08 C

0.1

C A B

0.05

C

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

PIN 1 INDEX AREA

SEATING PLANE

PIN 1 ID

1

8

14

21

26

27

28

29

30

SYMM

SCALE 2.500

A

B

C