D3+

D4+

SCL

SDA

THERM

ADD

V+

THERM2

14

4

3

13

12

9

TMP464

11

10

D1+

D2+

D-

6

5

7

GND

8

CDIFF

RS1

RS2

CDIFF

RS1

RS2

CDIFF

RS1

RS2

CDIFF

RS1

RS2

1.7 V to 3.6 V

CBYPASS

RSCL

RSDA

RT

RT2

Two-Wire

Interface

SMBus / I

2C

Compatible

Controller

Overtemperature

Shutdown

Local

Zone 5

Remote

Zone 1

Remote

Zone 2

Remote

Zone 3

Remote

Zone 4

Copyright © 2017, Texas Instruments Incorporated

28

TMP464

SBOS835C – MAY 2017 – REVISED OCTOBER 2019

www.ti.com

Product Folder Links: TMP464

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Copyright © 2017–2019, Texas Instruments Incorporated

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TMP464 device requires a transistor connected between the D+ and D– pins for remote temperature

measurement. Tie the D+ pin to D– if the remote channel is not used and only the local temperature is

measured. The SDA, ALERT, and THERM pins (and SCL, if driven by an open-drain output) require pullup

resistors as part of the communication bus. TI recommends a 0.1-µF power-supply decoupling capacitor for local

bypassing. Figure 20 and Figure 21 illustrate the typical configurations for the TMP464 device.

8.2 Typical Application

(1)

The diode-connected configuration provides better settling time. The transistor-connected configuration provides

better series resistance cancellation. TI recommends a MMBT3904 or MMBT3906 transistor with an η-factor of 1.008.

(2)

RS (optional) is < 1 kΩ in most applications. RS is the combined series resistance connected externally to the D+, D–

pins. RS selection depends on the application.

(3)

CDIFF (optional) is < 1000 pF in most applications. CDIFF selection depends on the application; see Figure 7.

(4)

Unused diode channels must be tied to D– .

Figure 20. TMP464 Basic Connections Using a Discrete Remote Transistor