10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

• Texas Instruments, Improve Stability Issues with Low CON Multiplexers application brief.

• Texas Instruments, Improving Signal Measurement Accuracy in Automated Test Equipment application brief

• Texas Instruments, Sample & Hold Glitch Reduction for Precision Outputs Reference Design reference guide.

• Texas Instruments, Simplifying Design with 1.8 V logic Muxes and Switches application brief.

• Texas Instruments, System-Level Protection for High-Voltage Analog Multiplexers application reports.

• Texas Instruments, True Differential, 4 x 2 MUX, Analog Front End, Simultaneous-Sampling ADC Circuit

application reports.

• Texas Instruments, QFN/SON PCB Attachment application reports.

• Texas Instruments, Quad Flatpack No-Lead Logic Packages application reports.

• Texas Instruments, Using Latch Up Immune Multiplexers to Help Improve System Reliability application

reports.

10.2 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on

Notifications to register and receive a weekly digest of any product information that has changed. For change

details, review the revision history included in any revised document.

10.3 Support Resources

TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight

from the experts. Search existing answers or ask your own question to get the quick design help you need.

Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do

not necessarily reflect TI's views; see TI's Terms of Use.

10.4 Trademarks

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.

10.5 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled

with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may

be more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

10.6 Glossary

TI Glossary

This glossary lists and explains terms, acronyms, and definitions.

11 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (January 2022) to Revision E (July 2024)

Page

• Updated HBM ESD for all packages.................................................................................................................. 5

• Updated IIH max specification............................................................................................................................7

TMUX6208, TMUX6209

SCDS419E – NOVEMBER 2020 – REVISED JULY 2024

www.ti.com

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Product Folder Links: TMUX6208 TMUX6209