SC2569

Safety-Chip

© Safety-Chip Micro

4

www.safety-chip.com

SC2569_Datasheet_V1.0_EN

Pin Descriptions

Name

Pin

I/O

Description

GND

1

P

Ground

FB

2

I

Feedback input pin. PWM duty cycle is determined by voltage level into this

pin and current-sense signal level at Pin 6.

VIN

3

I

Connected through a large value resistor to rectified line input for Startup IC

supply and line voltage sensing.

RI

4

I

Internal Oscillator frequency setting pin. A resistor connected between RI

and GND sets the PWM frequency.

RT

5

I

Temperature sensing input pin. Connected through a NTC resistor to GND.

SENSE

6

I

Current sense input. Connected to MOSFET current sensing resistor node.

VDD

7

P

DC Power Supply pin.

GATE

8

O

Totem-pole gate drive output for power MOSFET.

Absolute Maximum Ratings

Symbol

Parameter

Min.

Max.

Unit

VDD/VIN

DC Supply Voltage

28

V

VDD_Clamp

VDD Clamp Voltage

30

V

IDD_Clamp

VDD Clamp Continuous Current

10

mA

VFB

FB Input Voltage

-0.3V

6.5

V

VSENSE

SENSE Input Voltage

-0.3V

6.5

V

VRT

RT Input Voltage

-0.3V

6.5

V

VRI

RI Input Voltage

-0.3V

6.5

V

RJA

SOP-8 Thermal Resistance (Junction-to-Air)

120

℃/W

TJ

Operating Junction Temperature

-20

125

℃

TSTG

Storage Temperature Range

-55

150

℃

TL

Lead Temperature (Wave Soldering or IR,10Seconds)

260

℃

ESD

Human Body Model,JEDEC:JESD22-A114

2.5

KV

Machine Model, JEDEC:JESD22- A115

250

V

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are

stress ratings only, functional operation of the device at these or any other conditions beyond those indicated under

“recommended operating conditions” is not implied. Exposure to absolute maximum-rated conditions for extended period

may affect device’s reliability.

Recommended Operating Conditions

Symbol

Parameter

Min.

Max.

Unit

VDD

DC Supply Voltage

12

23

V

TA

Operating Ambient Temperature

-20

85

℃

RI

RI Resistor Value

24

31

K

Ω

Maximum practical continuous power in an open frame design with sufficient drain pattern as a heat sink, at 45℃ ambient.

Higher output power is possible with extra added heat sink or air circulation to reduce thermal resistance.