TDA2SA datasheet(167/427 Pages) TI2

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167

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

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SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Specifications

5.7.12 PCIEPHY DC Electrical Characteristics

NOTE

The PCIe interfaces are compliant with the electrical parameters specified in PCI Express®

Base Specification Revision 3.0.

5.8

Thermal Resistance Characteristics

For reliability and operability concerns, the maximum junction temperature of the Device has to be at or

below the TJ value identified in Table 5-4, Recommended Operating Conditions.

A BCI compact thermal model for this Device is available and recommended for use when modeling

thermal performance in a system.

Therefore, it is recommended to perform thermal simulations at the system level with the worst case

device power consumption.

5.8.1

Package Thermal Characteristics

Table 5-18 provides the thermal resistance characteristics for the package used on this device.

NOTE

Power dissipation of 1.5 W and an ambient temperature of 85ºC is assumed for ABC

package.

Table 5-18. Thermal Resistance Characteristics

NO.

PARAMET

DESCRIPTION

°C/W(1)

AIR FLOW (m/s)(2)

RΘJC

Junction-to-case

0.82

N/A

RΘJB

Junction-to-board

3.78

N/A

RΘJA

Junction-to-free air

11.1

Junction-to-moving air

8.8

8.0

7.5

ΨJT

Junction-to-package top

0.62

0.66

T10

0.66

T11

ΨJB

Junction-to-board

3.43

T12

3.22

T13

3.12

T14

3.04

(1) These values are based on a JEDEC defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a

JEDEC defined 1S0P system) and will change based on environment as well as application. For more information, see these

EIA/JEDEC standards:

–

JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

–

JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-6, Integrated Circuit Thermal Test Method Environmental Conditions - Forced Convection (Moving Air)

–

JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

–

JESD51-9, Test Boards for Area Array Surface Mount Packages

(2) m/s = meters per second

5.9

Power Supply Sequences

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