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TDA2SA Datasheet(PDF) 165 Page - Texas Instruments

Part # TDA2SA
Description  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TDA2SA Datasheet(HTML) 165 Page - Texas Instruments

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TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
www.ti.com
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Specifications
Copyright © 2015–2019, Texas Instruments Incorporated
5.7.9
Dual Voltage SDIO1833 DC Electrical Characteristics
Table 5-16 summarizes the DC electrical characteristics for Dual Voltage SDIO1833 Buffers.
Table 5-16. Dual Voltage SDIO1833 DC Electrical Characteristics
PARAMETER
MIN
NOM
MAX
UNIT
Signal Names in Mode 0: mmc1_clk, mmc1_cmd, mmc1_data[3:0]
Bottom Balls: W6 / Y6 / AA6 / Y4 / AA5 / Y3
1.8-V Mode
VIH
Input high-level threshold
1.27
V
VIL
Input low-level threshold
0.58
V
VHYS
Input hysteresis voltage
50 (2)
mV
IIN
Input current at each I/O pin
30
µA
IOZ
IOZ(IPAD Current) for BIDI cell. This current is contributed by the
tristated driver leakage + input current of the Rx + weak
pullup/pulldown leakage. PAD is swept from 0 to VDDS and the
Max(I(PAD)) is measured and is reported as IOZ
30
µA
IIN with
pulldown
enabled
Input current at each I/O pin with weak pulldown enabled
measured when PAD = VDDS
50
120
210
µA
IIN with
pullup
enabled
Input current at each I/O pin with weak pullup enabled measured
when PAD = 0
60
120
200
µA
CPAD
Pad capacitance (including package capacitance)
5
pF
VOH
Output high-level threshold (IOH = 2 mA)
1.4
V
VOL
Output low-level threshold (IOL = 2 mA)
0.45
V
3.3-V Mode
VIH
Input high-level threshold
0.625 ×
VDDS
V
VIL
Input low-level threshold
0.25 × VDDS
V
VHYS
Input hysteresis voltage
40 (2)
mV
IIN
Input current at each I/O pin
110
µA
IOZ
IOZ(IPAD Current) for BIDI cell. This current is contributed by the
tristated driver leakage + input current of the Rx + weak
pullup/pulldown leakage. PAD is swept from 0 to VDDS and the
Max(I(PAD)) is measured and is reported as IOZ
110
µA
IIN with
pulldown
enabled
Input current at each I/O pin with weak pulldown enabled
measured when PAD = VDDS
40
100
290
µA
IIN with
pullup
enabled
Input current at each I/O pin with weak pullup enabled measured
when PAD = 0
10
100
290
µA
CPAD
Pad capacitance (including package capacitance)
5
pF
VOH
Output high-level threshold (IOH = 2 mA)
0.75 × VDDS
V
VOL
Output low-level threshold (IOL = 2 mA)
0.125 ×
VDDS
V
(1) VDDS stands for corresponding power supply (that is vddshv8). For more information on the power supply name and the corresponding
ball, see Table 4-2, POWER [11] column.
(2) Hysteresis is enabled/disabled with CTRL_CORE_CONTROL_HYST_1.SDCARD_HYST register.
5.7.10 Dual Voltage LVCMOS DC Electrical Characteristics
Table 5-17 summarizes the DC electrical characteristics for Dual Voltage LVCMOS Buffers.



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