TDA2SA datasheet(418/427 Pages) TI2

418 / 427 page

418

TDA2SX, TDA2SG, TDA2SA

TDA2HG, TDA2HV, TDA2HF, TDA2LF

SPRS951F – DECEMBER 2015 – REVISED MAY 2019

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Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF

Device and Documentation Support

Table 9-1. Nomenclature Description (continued)

FIELD

PARAMETER

FIELD

DESCRIPTION

VALUES

DESCRIPTION

MARKING

ORDERABLE

Device Speed

Indicates the speed grade for each of the cores in the

device. For more information see , Device Comparison

Table.

Device type

BLANK

General purpose (Prototype and Production)

Emulation (E) devices

High security devices

Temperature (2)

Industrial: -40°C to 85°C (initial prototypes)

Full temp range: -40°C to 125°C

PPP

Package

designator

ABC

ABC S-PBGA-N760 (23mm × 23mm) Package

Carrier designator

N/A

BLANK

Tray

N/A

Tape & Reel

Automotive

Designator

BLANK

Does not meets automotive qualification

Meets Q100 equal requirements, with exceptions as

specified in DM.

XXXXXXX

As marked

N/A

Lot Trace Code

YYY

As marked

N/A

Production Code, For TI use only

ZZZ

As marked

N/A

Production Code, For TI use only

As marked

N/A

Pin one designator

As marked

N/A

ECAT—Green package designator

(1) To designate the stages in the product development cycle, TI assigns prefixes to the part numbers. These prefixes represent

evolutionary stages of product development from engineering prototypes through fully qualified production devices.

Prototype devices are shipped against the following disclaimer:

“This product is still in development and is intended for internal evaluation purposes.”

Notwithstanding any provision to the contrary, TI makes no warranty expressed, implied, or statutory, including any implied warranty of

merchantability of fitness for a specific purpose, of this device.

(2) Applies to device max junction temperature.

(3) X5777x is the base part number for the superset device. Software should constrain the features used to match the intended production

device.

NOTE

BLANK in the symbol or part number is collapsed so there are no gaps between characters.

9.2

Tools and Software

The following products support development for TDA2x platforms:

Design Kits and Evaluation Modules

TDA2x Vision EVM Kit – Spectrum Digital (Includes CPU Board and Vision Application Board)

TDA2x EVM is an evaluation platform designed to speed up development efforts and reduce

time to market for ADAS applications. It is based on a TDA2x SoC which incorporate a

heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point

TMS320C66x Digital Signal Processor (DSP) cores, Vision AccelerationPac (EVE) cores,

Arm® Cortex®-A15 MP cores, 3D GPU cores, H.264 encode/decode acceleration and dual-

Cortex-M4 processor cores. It also integrates a host of peripherals including multi-camera

interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN

and GigB Ethernet AVB. The main board integrates key peripherals such as Ethernet, FPD-

Link and HDMI, while the Vision application board provides interfaces for popular imagers

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