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TDA2SA Datasheet(PDF) 415 Page - Texas Instruments

Part # TDA2SA
Description  TDA2x ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
PDF  427 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

TDA2SA Datasheet(HTML) 415 Page - Texas Instruments

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DQLMX3
DQLMY0
DQLMY3
DQLMY2
DB3
DQLMX2
DB2
3
2
1
DQ[23:31]/DM3/DQS3
0
DQ[16:23]/DM2/DQS2
DQLMX1
DB1
DB0
DQLMX0
DQ[8:15]/DM1/DQS1
DQ[0:7]/DM0/DQS0
DQLMY1
DB0 - DB3 represent data bytes 0 - 3.
415
TDA2SX, TDA2SG, TDA2SA
TDA2HG, TDA2HV, TDA2HF, TDA2LF
www.ti.com
SPRS951F – DECEMBER 2015 – REVISED MAY 2019
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2SA TDA2HG TDA2HV TDA2HF TDA2LF
Applications, Implementation, and Layout
Copyright © 2015–2019, Texas Instruments Incorporated
There are four DQLMs, one for each byte (32-bit interface). Each DQLM is the longest Manhattan distance of the
byte; therefore:
DQLM0 = DQLMX0 + DQLMY0
DQLM1 = DQLMX1 + DQLMY1
DQLM2 = DQLMX2 + DQLMY2
DQLM3 = DQLMX3 + DQLMY3
Figure 8-84. DQLM for Any Number of Allowed DDR3 Devices
Table 8-53. Data Routing Specification(2)
NO.
PARAMETER
MIN
TYP
MAX
UNIT
DRS31
DB0 length
340
ps
DRS32
DB1 length
340
ps
DRS33
DB2 length
340
ps
DRS34
DB3 length
340
ps
DRS35
DBn skew(3)
5
ps
DRS36
DQSn+ to DQSn- skew
1
ps
DRS37
DQSn to DBn skew(3)(4)
5(10)
ps
DRS38
Vias per trace
2(1)
vias
DRS39
Via count difference
0(10)
vias
DRS310
Center-to-center DBn to other DDR3 trace spacing(6)
4
w(5)
DRS311
Center-to-center DBn to other DBn trace spacing(7)
3
w(5)
DRS312
DQSn center-to-center spacing(8) (9)
DRS313
DQSn center-to-center spacing to other net
4
w(5)
(1) Max value is based upon conservative signal integrity approach. This value could be extended only if detailed signal integrity analysis of
rise time and fall time confirms desired operation.
(2) External termination disallowed. Data termination should use built-in ODT functionality.
(3) Length matching is only done within a byte. Length matching across bytes is neither required nor recommended.
(4) Each DQS pair is length matched to its associated byte.
(5) Center-to-center spacing is allowed to fall to minimum 2w for up to 1250 mils of routed length.
(6) Other DDR3 trace spacing means other DDR3 net classes not within the byte.
(7) This applies to spacing within the net classes of a byte.
(8) DQS pair spacing is set to ensure proper differential impedance.
(9) The most important thing to do is control the impedance so inadvertent impedance mismatches are not created. Generally speaking,
center-to-center spacing should be either 2w or slightly larger than 2w to achieve a differential impedance equal to twice the singleended
impedance, Zo.
(10) Via count difference may increase by 1 only if accurate 3-D modeling of the signal flight times – including accurately modeled signal
propagation through vias – has been applied to ensure DBn skew and DQSn to DBn skew maximums are not exceeded.



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