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TMP421-Q1, TMP422-Q1, TMP423-Q1

www.ti.com

SBOS821 – NOVEMBER 2016

Product Folder Links: TMP421-Q1 TMP422-Q1 TMP423-Q1

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Power supply, VS

7

V

Input voltage

Pins 1, 2, 3, and 4 only

–0.5

VS + 0.5

V

Pins 6 and 7 only

–0.5

7

Input current

10

mA

Operational temperature

–55

127

°C

Junction temperature, TJ max

150

°C

Storage temperature, Tstg

–60

130

°C

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per AEC Q100-002(1)

±3000

V

Charged-device model (CDM), per AEC Q100-011

±750

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Temperature

–40

125

°C

Power-supply voltage

2.7

5.5

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

TMP42x-Q1

UNIT

DCN (SOT-23)

8 PINS

RθJA

Junction-to-ambient thermal resistance

147

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

115

°C/W

RθJB

Junction-to-board thermal resistance

33

°C/W

ψJT

Junction-to-top characterization parameter

38

°C/W

ψJB

Junction-to-board characterization parameter

33

°C/W