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DS20007047B-page 11

MIC26901

FIGURE 2-31:

Efficiency (VIN = 24V) vs.

Output Current.

FIGURE 2-32:

IC Power Dissipation

(VIN = 24V) vs. Output Current.

FIGURE 2-33:

Die Temperature* (VIN =

24V) vs. Output Current.

FIGURE 2-34:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-35:

Thermal Derating* vs.

Ambient Temperature.

FIGURE 2-36:

Thermal Derating* vs.

Ambient Temperature.

*Die Temperature & Thermal Derating: The temperature measurement was taken at the hottest point on the

MIC26901 case mounted on a 5 square inch, 4 layer PCB, tested in ambient temperature of 23°C to 25°C in open space

with no forced cooling; see the Thermal Measurements section. Actual results will depend upon the size of the PCB,

ambient temperature, and proximity to other heat-emitting components.

50

55

60

65

70

75

80

85

90

95

100

0246

8

10

OUTPUT CURRENT (A)

0.8V

0.9V

1V

1.2V

1.5V

1.8V

2.5V

3.3V

5V

V

OUT =

0

0.5

1

1.5

2

2.5

3

3.5

4

0123456789

OUTPUT CURRENT (A)

0.8V

0.9V

1.0V

1.2V

1.5V

1.8V

2.5V

3.3V

5.0V

V

OUT =

0

20

40

60

80

100

0123456789

OUTPUT CURRENT (A)

V

IN = 24V

V

OUT = 1.8V

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

1.5V

0.8V

VIN = 5V

VOUT = 0.8, 1.2, 1.5V

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

3.3V

1.8V

VIN = 5V

VOUT = 1.8, 2.5, 3.3V

0

2

4

6

8

10

12

14

-50

-25

0

25

50

75

100

125

AMBIENT TEMPERATURE (°C)

VIN = 12V

VOUT = 0.8, 1.2, 1.8V

1.8V

0.8V