12W+12W, Low-EMI, Spread-Spectrum,

Stereo, Class D Amplifier

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All voltages referenced to GND.)

VDD to PGND, AGND .............................................................30V

OUTR_, OUTL_, C1N..................................-0.3V to (VDD + 0.3V)

C1P............................................(VDD - 0.3V) to (CHOLD + 0.3V)

CHOLD ........................................................(VDD - 0.3V) to +40V

SHDN, FS_, G_ ...........................................................-6.3V to 8V

All Other Pins to GND.............................................-0.3V to +12V

Duration of OUTR_/OUTL_

Short Circuit to GND, VDD ......................................Continuous

Continuous Input Current (VDD, PGND) ..................................2A

Continuous Input Current (all other pins)..........................

±20mA

Thermal Limits (Note 1)

Continuous Power Dissipation (TA = +70°C)

Single-Layer PC Board

56-Pin TQFN (derate 28.6mW/°C above +70°C) ............2.29W

θJA ................................................................................ 35°C/W

θJC............................................................................... 0.6°C/W

Continuous Power Dissipation (TA = +70°C)

Multiple-Layer PC Board

56-Pin TQFN (derate 47.6mW/°C above +70°C) ............3.81W

θJA................................................................................ 21°C/W

θJC............................................................................... 0.6°C/W

Junction Temperature ......................................................+150°C

Operating Temperature Range ...........................-40°C to +85°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

ELECTRICAL CHARACTERISTICS

(VDD = 18V, GND = PGND = 0V, SHDN

≥ VIH, AV = 16dB, CSS = CIN = 0.47µF, CREG = 0.01µF, C1 = 100nF, C2 = 1µF, FS1 = FS2 =

GND (fS = 670kHz), RL connected between OUTL+ and OUTL- and OUTR+ and OUTR-, TA = TMIN to TMAX, unless otherwise noted.

Typical values are at TA = +25°C.) (Notes 1, 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

GENERAL

Supply Voltage Range

VDD

Inferred from PSRR test

10

25

V

Quiescent Current

IDD

RL = Open

26

37

mA

Shutdown Current

ISHDN

0.2

1.5

µA

CSS = 470nF

100

Turn-On Time

tON

CSS = 180nF

50

ms

Amplifier Output Resistance in

Shutdown

SHDN = GND

150

320

k

Ω

AV = 13dB

35

53

80

AV = 16dB

30

45

65

AV = 19.1dB

23

36

55

Input Impedance

RIN

AV = 29.6dB

10

14.3

22

k

Ω

G1 = L, G2 = L

29.4

29.6

29.8

G1 = L, G2 = H

18.9

19.1

19.3

G1 = H, G2 = L

12.8

13

13.2

Voltage Gain

AV

G1 = H, G2 = H

15.9

16

16.3

dB

Gain Matching

Between channels

0.5

%

Output Offset Voltage

VOS

±5

±30

mV

Common-Mode Rejection Ratio

CMRR

fIN = 1kHz, input referred

60

dB

VDD = 10V to 25V

48

83

fRIPPLE = 1kHz

80

Power-Supply Rejection Ratio

(Note 3)

PSRR

200mVP-P ripple

fRIPPLE = 20kHz

60

dB

Note 1: Thermal performance of this device is highly dependant on PC board layout. See the Applications Information for more

detail.