5.4 Thermal Information: OPA396

THERMAL METRIC(1)

OPA396

UNIT

DCK (SC70)

5 PINS

RθJA

Junction-to-ambient thermal resistance

214

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

115

°C/W

RθJB

Junction-to-board thermal resistance

58

°C/W

ΨJT

Junction-to-top characterization parameter

29

°C/W

ΨJB

Junction-to-board characterization parameter

58

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.5 Thermal Information: OPA2396

THERMAL METRIC(1)

OPA2396

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

152.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

61.7

°C/W

RθJB

Junction-to-board thermal resistance

86.8

°C/W

ΨJT

Junction-to-top characterization parameter

5.2

°C/W

ΨJB

Junction-to-board characterization parameter

85.5

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.6 Thermal Information: OPA4396

THERMAL METRIC(1)

OPA4396

UNIT

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

109.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

27.4

°C/W

RθJB

Junction-to-board thermal resistance

56.1

°C/W

ΨJT

Junction-to-top characterization parameter

1.5

°C/W

ΨJB

Junction-to-board characterization parameter

54.9

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

OPA396, OPA2396, OPA4396

SBOSA65A – JULY 2021 – REVISED MARCH 2026

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Product Folder Links: OPA396 OPA2396 OPA4396