DAC39RF10 datasheet(224/232 Pages) TI2

Part #	DAC39RF10

Description	DAC39RFx10-SP DAC39RFx10-SEP 10.4 or 20.8GSPS, 16-bit, Dual and Single Channel, Multi-Nyquist Digital-to-Analog Converter (DAC) with JESD204C Interface

PDF	232 Pages

Scroll/Zoom	100%

Manufacturer	TI2 [Texas Instruments]

Direct Link	https://www.ti.com

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Layer14 / PWR4

DAC VDDR = RED

DAC VDDSYS18 = GREEN

DAC VDDCLK18 = BLUE

VDDIO = WHITE

Figure 9-32. Power Plane Layout for Layer 14

In addition, TI recommends the following general PCB fabrication considerations for all high-speed PCB designs:

1. Use high quality dielectric materials for any critical signal layers within the PCB stack-up. Typically, the top

and bottom layers are the most critical and more board houses can implement a mix of high and standard

quality dielectrics, also known as a hybrid stack-up.

2. Use multiple power layers if necessary to provide a robust power delivery system to the converter.

3. Use multiple ground, power, ground layer stacks within the PCB to develop high frequency decoupling within

the PCB, the recommendation for these layers is 4 mils or less.

4. Use a solid ground plane, do not split or “slot” the ground plane to create an analog versus digital grounding

barrier or divider to avoid harm.

DAC39RF10-SP, DAC39RF10-SEP

DAC39RFS10-SP, DAC39RFS10-SEP

SBAS932A – MARCH 2024 – REVISED FEBRUARY 2026

www.ti.com

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Product Folder Links: DAC39RF10-SP DAC39RF10-SEP DAC39RFS10-SP DAC39RFS10-SEP

DAC39RF10 Datasheet(PDF) 224 Page - Texas Instruments