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DAC39RF10 Datasheet(PDF) 226 Page - Texas Instruments |
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DAC39RF10 Datasheet(HTML) 226 Page - Texas Instruments |
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226 / 232 page ![]() PACKAGE OPTION ADDENDUM www.ti.com 21-May-2026 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) DAC39RF10ACL-MLS Active Production FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) - Call TI Call TI -55 to 125 DAC39RF10 MLS DAC39RF10ACLNSP Active Production FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) No SNPB Level-3-220C-168 HR -55 to 125 DAC39RF10 NSP DAC39RFS10ACL-MLS Active Production FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) - Call TI Call TI -55 to 125 DAC39RFS10 MLS DAC39RFS10ACLNSP Active Production FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) No SNPB Level-3-220C-168 HR -55 to 125 DAC39RFS10 NSP PDAC39RF10ACL Active Preproduction FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) - Call TI Call TI 25 to 25 PDAC39RFS10ACL Active Preproduction FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) - Call TI Call TI 25 to 25 SN0256ACL-DC Active Production FCBGA (ACL) | 256 90 | JEDEC TRAY (5+1) - Call TI Call TI -55 to 125 256ACL DC SNPB (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Addendum-Page 1 |
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