AD7490BCPZ datasheet(27/28 Pages) AD

27 / 28 page

Data Sheet

AD7490

Rev. E | Page 27 of 28

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-153-AE

8 °

0 °

SEATING

PLANE

COPLANARITY

0.10

1.20 MAX

6.40 BSC

0.65

BSC

PIN 1

0.30

0.19

0.20

0.09

4.50

4.40

4.30

0.75

0.60

0.45

9.80

9.70

9.60

0.15

0.05

Figure 33. 28-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-28)

Dimensions shown in millimeters

3.25

3.10 SQ

2.95

0.80

0.75

0.70

0.50

BSC

BOTTOM VIEW

TOP VIEW

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.50

0.40

0.30

0.20 MIN

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD

EXPOSED

PAD

SIDE VIEW

P IN 1

IN D IC AT O R AR E A OP T IO N S

(SEE DETAIL A)

DETAIL A

(JEDEC 95)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

PIN 1

INDICATOR

AREA

SEATING

PLANE

Figure 34. 32-Lead Lead Frame Chip Scale Package [LFCSP]

5 mm × 5 mm Body and 0.75 mm Package Height

(CP-32-7)

Dimensions shown in millimeters

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