Data Sheet

ADN4620/ADN4621

SPECIFICATIONS

analog.com

Rev. A | 5 of 28

Table 3.

Parameter

Symbol

Min

Typ

Max1

Unit

Test Conditions/Comments

MAXIMUM DATA RATE

2.5

Gbps

1 These specifications are guaranteed by design and characterization.

2 Duty cycle, or pulse skew, is the magnitude of the maximum difference between tPLH and tPHL for any Channel x of a device (where x = 1 or 2), that is, |tPLHx – tPHLx|.

3 Channel to channel, or output skew, is the difference between the largest and smallest values of tPLHx within a device or the difference between the largest and smallest

values of tPHLx within a device, whichever of the two is greater.

4 Part to part output skew is the difference between the largest and smallest values of tPLHx across multiple devices or the difference between the largest and smallest values

of tPHLx across multiple devices, whichever of the two is greater.

5 Jitter parameters are guaranteed by design and characterization. Values do not include stimulus jitter. VID = 400 mV p-p, VIC = 1.2 V, and tR / tF < 0.05 ns (20% to 80%).

6 This specification is measured over a population of ~3,000,000 edges.

7 Peak-to-peak jitter specifications include jitter due to pulse skew (tSK(D)).

8 Using the following formula: tTJ(p-p) = 14 × tRJ(rms) + tDJ(p-p).

9 With an input phase jitter of 340 fs rms subtracted.

10 With an input phase jitter of 155 fs rms subtracted.

INSULATION AND SAFETY RELATED SPECIFICATIONS

For additional information, see www.analog.com/icouplersafety.

Table 4. RS-20 Shrink Small Outline Package [SSOP]

Parameter

Symbol

Value

Unit

Test Conditions/Comments

Rated Dielectric Insulation Voltage

3.75

kV rms

1 minute duration

Minimum External Air Gap (Clearance)

L (I01)

5.3

mm

Measured from input terminals to output terminals, shortest distance

through air

Minimum External Tracking (Creepage)

L (I02)

5.3

mm

Measured from input terminals to output terminals, shortest distance

path along body

Minimum Clearance in the Plane of the Printed Circuit Board

(PCB Clearance)

L (PCB)

5.6

mm

Measured from input terminals to output terminals, shortest distance

through air, line of sight, in the PCB mounting plane

Minimum Internal Gap (Internal Clearance)

34

µm

Insulation distance through insulation

Tracking Resistance (Comparative Tracking Index)

CTI

>600

V

Tested in accordance to IEC 60112

Material Group

I

Material group per IEC 60664-1

Table 5. RI-16-3 Wide Body, with 15.1 mm Creepage [SOIC_IC] Package

Parameter

Symbol

Value

Unit

Test Conditions/Comments

Rated Dielectric Insulation Voltage

7.5

kV rms

1 minute duration

Minimum External Air Gap (Clearance)

L (I01)

15.1

mm

Measured from input terminals to output terminals, shortest distance

through air

Minimum External Tracking (Creepage)

L (I02)

15.1

mm

Measured from input terminals to output terminals, shortest distance

path along body

Minimum Clearance in the Plane of the Printed Circuit Board

(PCB Clearance)

L (PCB)

16

mm

Measured from input terminals to output terminals, shortest distance

through air, line of sight, in the PCB mounting plane

Minimum Internal Gap (Internal Clearance)

34

µm

Insulation distance through insulation

Tracking Resistance (Comparative Tracking Index)

CTI

>600

V

Tested in accordance to IEC 60112

Material Group

I

Material group per IEC 60664-1

PACKAGE CHARACTERISTICS

Table 6. RS-20 Shrink Small Outline Package [SSOP] and RI-16-3 Wide Body, with 15.1 mm Creepage [SOIC_IC] Package

Parameter

Symbol

Min

Typ

Max

Unit

Test Conditions/Comments

Resistance (Input to Output)1

RI-O

1013

Ω

Voltage (input to output) (VI-O) = 500 V dc