Data Sheet

AD7699

Rev. F | Page 31 of 32

OUTLINE DIMENSIONS

0.50

BSC

0.50

0.40

0.30

0.30

0.25

0.20

COMPLIANT

TO JEDEC STANDARDS MO-220-WGGD.

BOTTOM VIEW

TOP VIEW

EXPOSED

PAD

PIN 1

INDICATOR

4.10

4.00 SQ

3.90

SEATING

PLANE

0.80

0.75

0.70

0.05 MAX

0.02 NOM

0.20 REF

0.25 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

2.65

2.50 SQ

2.35

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

1

20

6

10

11

15

16

5

Figure 44. 20-Lead Lead Frame Chip Scale Package (LFCSP_WQ)

4 mm × 4 mm Body, Very Very Thin Quad

(CP-20-10)

Dimensions shown in millimeters

A

B

C

D

E

2.430

2.390 SQ

2.350

1

2

3

4

5

6

7

8

9

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

BALL A1

IDENTIFIER

0.560

0.500

0.440

0.330

0.300

0.270

SIDE VIEW

0.230

0.200

0.170

0.300

0.260

0.220

0.50 REF

0.50 REF

0.25 REF

0.433

REF

COPLANARITY

0.05

SEATING

PLANE

Figure 45. 20-Ball Wafer Level Chip Scale Package (WLCSP)

(CB-20-12)

Dimensions shown in millimeters

ORDERING GUIDE

Model1, 2

Integral

Nonlinearity

No Missing

Code

Temperature

Range

Package Description

Package

Option

Ordering

Quantity

AD7699BCPZ

±1.5 LSB max

16 bits

−40°C to +85°C

20-Lead LFCSP_WQ, Tray

CP-20-10

490

AD7699BCPZRL7

±1.5 LSB max

16 bits

−40°C to +85°C

20-Lead LFCSP_WQ, Reel

CP-20-10

1500

AD7699BCBZ-RL7

±2.5 LSB max

16 bits

−40°C to +85°C

20-Ball WLCSP

CB-20-12

Reel, 1,500

AD7699BCBZ-WP

±2.5 LSB max

16 bits

−40°C to +85°C

20-Ball WLCSP

CB-20-12

EVAL-AD7699EDZ

Evaluation Board

EVAL-CED1Z

Controller Board

1

Z = RoHS Compliant Part.

2

The EVAL-CED1Z controller board allows a PC to control and communicate with all Analog Devices evaluation boards with model numbers ending in ED.