5. OPERATION(Continued)

(3) Cleaning

Cleaning is extremely important and should be done frequently during the desoldering process.

Parts should be checked periodically for wear and should be replaced if necessary. See the

MAINTENANCE section of these instructions.

• Clean the nozzle as you would clean a soldering tip: wipe away any excess solder with a

sponge moistened with de-ionized or distilled water, or using a wire tip cleaner.

Before putting the desoldering tool away, apply a new coat of solder on the tip.

• Using a cleaning pin that matches the diameter of the nozzle, clean the inside of the nozzle

opening. This must be done while the nozzle and heating core are still hot, so be careful.

• Discard any solder that has collected in the filter pipe. Do this carefully, as the solder will

still be extremely hot.

• Replace the filter. See the MAINTENANCE section of these instructions.

The ceramic paper filter (L) should be replaced immediately when a stain appears or vacuum

decreases. Failure to do this will reduce the performance of the pump and may damage it.

● Cleaning with cleaning pin

● Cleaning with cleaning drill

● Clean the heating core

The cleaning pin passes

completely through the hole.

Rotate the cleaning drill clockwise while inserting,

then pull straight out.

Scrape away all oxidation from the hole in the heating element until

the cleaning pin passes cleanly through the hole.

*Cleaning drill (optional)

The cleaning pin passes cleanly

and completely through the hole.

(4) Temperature setting

The temperature of the HAKKO FR-301 can be adjusted between 350 - 500 °C/660 - 930 °F.

Set the temperature in accordance with the requirements of the job being done. Although the

temperature needed for desoldering cannot be determined merely by the type of board to be

desoldered, the values in the table below may be used as a general guide.

6. MAINTENANCE

The frequency of cleaning and part replacement greatly depends on a variety of factors,

including the temperature at which the desoldering tool is operated, and the types of

solder and flux used. Using the table below as a general guide, clean and replace parts in

accordance with use conditions.

Maintenance

During use

Clean nozzle

Discard solder that has collected

Clean nozzle and heating core

When necessary

Replace parts

Periodically

Clean pump

Low

High

CAUTION

Change the temperature only with the temp. control knob.

Do not use the “CAL” trim pot.

Type of board

Approximate setting (on scale)

Single-sided P.W.B.

1

Through-hole P.W.B.

2

Multilayer P.W.B.

3 to 4

• In general, the greater the temperature, the more quickly the

nozzle will oxidize and wear out.

• As nozzle oxidation and wear increases, the nozzle temperature

will decrease. In such cases, increasing the set temperature

will only accelerate oxidation and hasten wear.

Replace worn nozzles as soon as possible.