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ADP120 Datasheet(PDF) 17 Page - Analog Devices

Part # ADP120
Description  100 mA, Low Quiescent Current, CMOS Linear Regulator
PDF  20 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP120 Datasheet(HTML) 17 Page - Analog Devices

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ADP120
Rev. A | Page 17 of 20
PCB LAYOUT CONSIDERATIONS
In cases where the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction
temperature rise. Maximum junction temperature (TJ) is
calculated from the board temperature (TB) and power
dissipation (PD) using the formula
TJ = TB + (PD × ΨJB)
(5)
Improve heat dissipation from the package by increasing the
amount of copper attached to the pins of the ADP120. However,
as listed in Table 6, a point of diminishing returns is eventually
reached, beyond which an increase in the copper size does not
yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402- or 0603-size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
140
120
100
80
60
40
20
0
0.5
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
VIN – VOUT (V)
MAX JUNCTION TEMPERATURE
IL = 1mA
IL = 10mA
IL = 25mA
IL = 50mA
IL = 75mA
IL = 100mA
J1
ANALOG DEVICES
ADP120-xx-EVALZ
VIN
VOUT
GND
EN
GND
C1
C2
GND
GND
U1
Figure 46. TSOT, TB = 85°C
140
120
100
80
60
40
20
0
0.5
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
VIN – VOUT (V)
MAX JUNCTION TEMPERATURE
IL = 1mA
IL = 10mA
IL = 25mA
IL = 50mA
IL = 75mA
IL = 100mA
Figure 48. TSOT PCB Layout
GND
GND
VIN
VOUT
EN
C1
C2
J1
ADP120CB-xx-EVALZ
U1
WLC
SP
Figure 47. WLCSP, TB = 85°C
Figure 49. WLCSP PCB Layout



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