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BUF16821 Datasheet(PDF) 22 Page - EPCOS |
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BUF16821 Datasheet(HTML) 22 Page - EPCOS |
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22 / 29 page ![]() DIE SideView(a) EndView(b) BottomView(c) DIE Thermal Pad P = D T MAX A - T q JA ( ) (2) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 - 40 - 20 0 100 40 60 80 20 T ,Free-AirTemperature( ° C) A BUF16821 SBOS428 – JULY 2008 ...................................................................................................................................................................................................... www.ti.com Figure 19. Views of Thermally-Enhanced PWP Package For a given θ JA (listed in the Electrical Characteristics), the maximum power dissipation is shown in Figure 20 and calculated by Equation 2: Where: PD = maximum power dissipation (W) TMAX = absolute maximum junction temperature (+125°C) TA = free-ambient air temperature (°C) Figure 20. Maximum Power Dissipation vs Free-Air Temperature (with PowerPAD soldered down) 22 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated Product Folder Link(s): BUF16821 |
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