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M61558FP Datasheet(PDF) 14 Page - Renesas Technology Corp |
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M61558FP Datasheet(HTML) 14 Page - Renesas Technology Corp |
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14 / 18 page ![]() M61558FP Rev.1.0, Sep.19.2003, page 14 of 17 LPF circuit The output LPF circuit must have characteristics in accord with the signal-frequency band and characteristic impedance value of the speaker that constitutes the load. The simplest example is a second-order Butterworth filter in an LC configuration. Damping circuit When the speaker is removed, the frequency characteristics of the low-pass filter may lead to problems of high-band characteristics such as peaking. Accordingly, a high-band damping circuit should be installed in parallel with the speaker. (Take the allowable power, etc., of the damping resistor into consideration.) Zener diode for surge protection Ringing, etc., occurs during the high-speed switching operation of this IC. During short-circuit, connection to ground or VDD of load, very large surge voltages are generated. When the surge voltage exceeds the voltage tolerance of the transistors (step-down voltage between source and drain, etc.), the IC may be damaged. We recommend that you prevent damage to this IC by connecting a Zener diode for surge protection to the output pins (select a Zener voltage slightly below 35 V). Precautions on wiring for the protective circuits PRVD (pin 18) is wired to the protective detection circuits. Use as short a wiring run as is possible to connect this pin to a point on the VD power-supply line near the VD pin. This point should not be readily affected by variation in voltages due to power supply and the operating conditions. Please take care because this may affect the characteristics of the protective circuits or damage the IC. Measures against EMI Please note the need to reduce the levels of unwanted radiation components produced by high-speed switching operation. For example, apply countermeasures such as raising the order of the output LPF circuit, or attaching a capacitor with a value of about 1000 pF to the speaker pin. Single-ended operation This IC is for bridge-tied load (BTL) operation, but single-ended operation for an independent half-bridge configuration is possible. In this case, note that performance changes (e.g. 30 W x 1 ch. becomes 7.5 W x 2 ch). Also, other parts of the IC are designed on the specific assumption of BTL operation, so sufficient evaluation and examination is required. Pop noise when turning the power supply on and off One simple countermeasure against pop noise is to ensure that VD (power-stage power-supply voltage ) is only turned on and off while VDD (power-supply voltage of the pre-driver stage) is applied. If this measure is ignored, pop noise may occur when the power supply is turned on or off. We also recommend operation under the condition VDD < VD. Consider turning the power supply on and off in the following sequence. |
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