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OPA4872MDREP Datasheet(PDF) 19 Page - Texas Instruments |
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OPA4872MDREP Datasheet(HTML) 19 Page - Texas Instruments |
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19 / 24 page ![]() P =10V 11.7mA+ 5 /[4 (150 ||1046 )] =165mW ´ W ( ) D ´ W 2 MaximumT =+85 C+(165mW 80 C/W)=98 C ° ´ J ° ° BOARD LAYOUT GUIDELINES OPA4872-EP www.ti.com........................................................................................................................................................................................... SBOS444 – DECEMBER 2008 As a worst-case example, compute the maximum TJ Again, keep their leads and PCB trace length as short using an OPA4872ID in the circuit of Figure 27 as possible. Never use wirewound type resistors in a operating at the maximum specified ambient high-frequency application. Other network temperature of +85°C with its output driving a components, such as noninverting input termination grounded 100- Ω load to +2.5 V: resistors, should also be placed close to the package. d) Connections to other wideband devices on the board may be made with short direct traces or through onboard transmission lines. For short connections, consider the trace and the input to the next device as a lumped capacitive load. Relatively This worst-case condition does not exceed the wide traces (50mils to 100mils) should be used, maximum junction temperature. Normally, this preferably with ground and power planes opened up extreme case is not encountered. around them. Estimate the total capacitive load and set RS from the plot of Figure 5. Low parasitic capacitive loads Achieving optimum performance with a (greater than 5 pF) may not need an RS because the high-frequency amplifier such as the OPA4872 OPA4872 is nominally compensated to operate with a requires careful attention to board layout parasitics 2-pF parasitic load. If a long trace is required, and the and external component types. Recommendations to 6dB signal loss intrinsic to a doubly-terminated optimize performance include: transmission line is acceptable, implement a matched a) Minimize parasitic capacitance to any ac impedance transmission line using microstrip or ground for all of the signal I/O pins. Parasitic stripline techniques (consult an ECL design handbook capacitance on the output pin can cause instability; for microstrip and stripline layout techniques). A 50- Ω on the noninverting input, it can react with the source environment is normally not necessary on the board, impedance to cause unintentional bandlimiting. To and in fact, a higher impedance environment reduce unwanted capacitance, a window around the improves distortion as shown in the Distortion versus signal I/O pins should be opened in all of the ground Load plot; see Figure 7. With a characteristic board and power planes around those pins. Otherwise, trace impedance defined based on board material ground and power planes should be unbroken and trace dimensions, a matching series resistor into elsewhere on the board. the trace from the output of the OPA4872 is used as well as a terminating shunt resistor at the input of the b) Minimize the distance (< 0.25") from the destination device. Remember also that the power-supply pins to high frequency 0.1- µF terminating impedance is the parallel combination of decoupling capacitors. At the device pins, the the shunt resistor and the input impedance of the ground and power plane layout should not be in close destination device; this total effective impedance proximity to the signal I/O pins. Avoid narrow power should be set to match the trace impedance. The and ground traces to minimize inductance between high output voltage and current capability of the the pins and the decoupling capacitors. The OPA4872 allow multiple destination devices to be power-supply connections (on pins 9, 11, 13, and 15) handled as separate transmission lines, each with its should always be decoupled with these capacitors. own series and shunt terminations. If the 6-dB An optional supply decoupling capacitor across the attenuation of a doubly-terminated transmission line two power supplies (for bipolar operation) improves is unacceptable, a long trace can be 2nd harmonic distortion performance. Larger (2.2 µF series-terminated at the source end only. Treat the to 6.8 µF) decoupling capacitors, effective at lower trace as a capacitive load in this case and set the frequency, should also be used on the main supply series resistor value as shown in Figure 5. This pins. These capacitors may be placed somewhat configuration does not preserve signal integrity as farther from the device and may be shared among well as a doubly-terminated line. If the input several devices in the same area of the PCB. impedance of the destination device is low, there will c) Careful selection and placement of external be some signal attenuation because of the voltage components preserves the high-frequency divider formed by the series output into the performance of the OPA4872. Resistors should be terminating impedance. a very low reactance type. Surface-mount resistors work best and allow a tighter overall layout. Metal-film and carbon composition, axially-leaded resistors can also provide good high-frequency performance. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 19 Product Folder Link(s): OPA4872-EP |
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