LT3972

23

3972f

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

MSE Package

10-Lead Plastic MSOP, Exposed Die Pad

(Reference LTC DWG # 05-08-1664 Rev B)

MSOP (MSE) 0307 REV B

0.53

0.152

(.021

.006)

SEATING

PLANE

0.18

(.007)

1.10

(.043)

MAX

0.17 – 0.27

(.007 – .011)

TYP

0.86

(.034)

REF

0.50

(.0197)

BSC

12 3 45

4.90

0.152

(.193

.006)

0.497

0.076

(.0196

.003)

REF

8

9

10

10

1

7 6

3.00

0.102

(.118

.004)

(NOTE 3)

3.00

0.102

(.118

.004)

(NOTE 4)

NOTE:

1. DIMENSIONS IN MILLIMETER/(INCH)

2. DRAWING NOT TO SCALE

3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

0.254

(.010)

0 – 6 TYP

DETAIL “A”

DETAIL “A”

GAUGE PLANE

5.23

(.206)

MIN

3.20 – 3.45

(.126 – .136)

0.889

0.127

(.035

.005)

RECOMMENDED SOLDER PAD LAYOUT

0.305

0.038

(.0120

.0015)

TYP

2.083

0.102

(.082

.004)

2.794

0.102

(.110

.004)

0.50

(.0197)

BSC

BOTTOM VIEW OF

EXPOSED PAD OPTION

1.83

0.102

(.072

.004)

2.06

0.102

(.081

.004)

0.1016

0.0508

(.004

.002)