LTM4604A datasheet(15/20 Pages) LINER

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LTM4604A

4604af

Safety Considerations

The LTM4604A modules do not provide isolation from

VIN to VOUT. There is no internal fuse. If required, a slow

blow fuse with a rating twice the maximum input current

needs to be provided to protect each unit from catastrophic

failure.

Layout Checklist/Example

The high integration of LTM4604A makes the PCB board

layout very simple and easy. However, to optimize its

electrical and thermal performance, some layout consid-

erations are still necessary.

• Use large PCB copper areas for high current path,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between top layer and other power layers.

• Do not put vias directly on the pads unless they are

capped.

• SW pads can be soldered to board to improve thermal

performance.

Figure 14 gives a good example of the recommended

layout.

Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design

Figure 14. Recommended PCB Layout

APPLICATIONS INFORMATION

GND

4604A F14

VOUT

VIN

CIN

COUT

VIN

2.375V TO 5.5V

PGOOD

COMP

LTM4604A

RUN/SS

RFB

5.69k

COUT

22μF ×3

6.3V

X5R OR X7R

VOUT

1.5V

CIN

10μF

6.3V

X5R OR X7R

OPEN-DRAIN

PULL UP

CSSEXT

0.01μF

VOUT

TRACK

GND

4604A F15

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