ADP1877ACPZ-R7 datasheet(6/32 Pages) AD

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ADP1877

Rev. 0 | Page 6 of 32

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN1/EN2, RAMP1/RAMP2

15 V

FB1/FB2, COMP1/COMP2, SS1/SS2,

TRK1/TRK2, FREQ, SYNC, VCCO, VDL,

PGOOD1/PGOOD2

−0.3 V to +6 V

ILIM1/ILIM2

−0.3 V to +16 V

BST1/BST2, DH1/DH2, SW1/SW2 to

PGND1/PGND2

−0.3 V to +22 V

DL1/DL2 to PGND1/PGND2

−0.3 V to VCCO +

0.3 V

BST1/BST2 to PGND1/PGND2, SW1/SW2 to

PGND1/PGND2 20 ns Transients

+25 V

DL1/DL2, SW1/SW2, ILIM1/ILIM2 to

PGND1/PGND2 20 ns Negative Transients

−8 V

PGND1/PGND2 to AGND

−0.3 V to +0.3 V

PGND1/PGND2 to AGND 20 ns Transients

−8 V to +4 V

θJA, =on a Multilayer PCB (Natural Convection)1,2

32.6°C/W

Operating Ambient Temperature Range3

−40°C to +85°C

Operating Junction Temperature Range3

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Maximum Soldering Lead Temperature

260°C

1 Measured with exposed pad attached to PCB.

2 Junction-to-ambient thermal resistance (θJA) of the package was calculated

or simulated on a multilayer PCB.

3 The device can be damaged when the junction temperature limits are

exceeded. Monitoring ambient temperature does not guarantee that TJ is

within the specified temperature limits. In applications with moderate

power dissipation and low PCB thermal resistance, the maximum ambient

temperature can exceed the maximum limit as long as the junction temperature

is within specification limits. The junction temperature, TJ, of the device is

dependent on the ambient temperature, TA, the power dissipation of the

device, PD, and the junction to ambient thermal resistance of the package,

θJA. Maximum junction temperature is calculated from the ambient

temperature and power dissipation using the formula TJ = TA + PD × θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or

any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified all other voltages are

referenced to GND.

ESD CAUTION

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