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MPC8548E Datasheet(PDF) 130 Page - Freescale Semiconductor, Inc |
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MPC8548E Datasheet(HTML) 130 Page - Freescale Semiconductor, Inc |
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130 / 144 page ![]() MPC8548E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 6 130 Freescale Semiconductor System Design Information Figure 59. SerDes PLL Power Supply Filter Note the following: •AVDD_SRDS should be a filtered version of SVDD. • Signals on the SerDes interface are fed from the XVDD power plane. 21.3 Decoupling Recommendations Due to large address and data buses, and high operating frequencies, the device can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the MPC8548E system, and the device itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD, TVDD, BVDD, OVDD, GVDD, and LVDD pin of the device. These decoupling capacitors should receive their power from separate VDD, TVDD, BVDD, OVDD, GVDD, LVDD, and GND power planes in the PCB, utilizing short low impedance traces to minimize inductance. Capacitors must be placed directly under the device using a standard escape pattern as much as possible. If some caps are to be placed surrounding the part it should be routed with large trace to minimize the inductance. These capacitors should have a value of 0.1 µF. Only ceramic SMT (surface mount technology) capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD, TVDD, BVDD, OVDD, GVDD, and LVDD, planes, to enable quick recharging of the smaller chip capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize inductance. Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON). However, customers should work directly with their power regulator vendor for best values, types and quantity of bulk capacitors. 21.4 SerDes Block Power Supply Decoupling Recommendations The SerDes block requires a clean, tightly regulated source of power (SVDD and XVDD) to ensure low jitter on transmit and reliable recovery of data in the receiver. An appropriate decoupling scheme is outlined below. Only surface mount technology (SMT) capacitors should be used to minimize inductance. Connections from all capacitors to power and ground should be done with multiple vias to further reduce inductance. • First, the board should have at least 10 × 10-nF SMT ceramic chip capacitors as close as possible to the supply balls of the device. Where the board has blind vias, these capacitors should be placed 2.2 µF 1 0.003 µF 1.0 Ω AVDD_SRDS Note: 1. An 0805 sized capacitor is recommended for system initial bring-up. SVDD 2.2 µF 1 GND |
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