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AS2702 Datasheet(PDF) 3 Page - ams AG

Part # AS2702
Description  AS-Interface Slave IC
PDF  13 Pages
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Manufacturer  AMSCO [ams AG]
Direct Link  http://www.ams.com
Logo AMSCO - ams AG

AS2702 Datasheet(HTML) 3 Page - ams AG

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AS2702 – AS-Interface Slave IC
Revision 1.3, 21-Aug-08
Page 3 of 13
SOIC 20
SOIC 16
Name
Type
Note
Description
14
12
PFAULT
I, digital, pull-up
1
Low-active input to flag failure of the sensors/actuators circuitry
connected
15
13
LED2
I/O, digital, pull-up 1
LED output 2 (IC test input)
16
14
PSTBn
I/O, digital, pull-up 1
Parameter port strobe output (IC test input)
17
15
D3
I/O, digital
Bidir. data port bit 3
18
16
D2
I/O, digital
Bidir. data port bit 2
19
-
P3
I/O, digital, pull-up 1, 2
Bidir. parameter port bit 3
20
-
P2
I/O, digital, pull-up 1, 2
Bidir. parameter port bit 2
Notes:
1
The pull-up structure is a passive high-side current source with a nom. 10µA current.
2
The passive pull-up current source as per note 1 on these parameter port pins is off, if the slave device is programmed with
I/O-configuration code 7 and a master data call is present.
Functional, Electrical and Timing Characteristics
All voltages are referenced to ground pin LTGN. Timing is valid for a quartz crystal frequency of 5.333MHz.
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Note
VLTGP
Voltage at the positive supply pin
-0.3
40
V
1)
VCDC
Voltage at pin for ext. buffer capacitor
-0.3
VLTGP + 0.3V
V
VU5R
Voltage at pins U5R, OSC1, OSC2
-0.3
7
V
IIN
Input current at any pin, except for LTGP, CDC
-50
50
mA
2)
ESD1
Electrostatic discharge voltage
1500
V
3)
ESD2
Electrostatic discharge voltage
300
V
4)
Tstg
Storage temperature
-55
125
V
Tbody
Soldering conditions
260
°C
5)
Ptot
Max. power dissipation
1
W
6)
RTHJA
Thermal resistance SOIC 16
61.2
74.8
°K/W
7)
RTHJA
Thermal resistance SOIC 20
58.5
71.5
°K/W
7)
Notes:
1)
50V during t > 50µs; repetition rate < 0.5Hz
2)
Latch-up immunity test. Please observe max. power dissipation allowed
3)
Human body model: R = 1.5kOhm; C = 100pF
4)
Machine model; applies only for LTGP
5)
The reflow peak soldering temperature (body temperature) is specified according IPC/JEDEC J-STD-020C.
6)
Free convection, see Figure 2
7)
No forced cooling. PCB-surface: 21 cm2; still air volume around the device. 10 cm3



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