SE97B datasheet(37/53 Pages) NXP

37 / 53 page

SE97B_1

Product data sheet

Rev. 01 — 27 January 2010

37 of 53

NXP Semiconductors

SE97B

DDR memory module temp sensor with integrated SPD

VOL(SDA) = LOW-level output voltage on pin SDA

VOL(EVENT) = LOW-level output voltage on pin EVENT

IOL(sink)(SDA) = SDA output current LOW

IOL(sink)EVENT = EVENT output current LOW

Calculation example:

Tamb (typical temperature inside the notebook) = 50 °C

IDD(AV) = 400 μA

VDD = 3.6 V

Maximum VOL(SDA) = 0.4 V

IOL(sink)(SDA) = 1 mA

VOL(EVENT) = 0.4 V

IOL(sink)EVENT = 3 mA

Rth(j-a) = 56 °C/W

Self heating due to power dissipation is:

(2)

9.4 Hot plugging

The SE97B can be used in hot plugging applications. Internal circuitry prevents damaging

current backflow through the device when it is powered down, but with the I2C-bus,

EVENT or address pins still connected. The open-drain SDA and EVENT pins (SCL and

address pins are input only) effectively places the outputs in a high-impedance state

during power-up and power-down, which prevents driver conflict and bus contention. The

50 ns noise filter will filter out any insertion glitches from the state machine, which is very

robust and not prone to false operation.

The device needs a proper power-up sequence to reset itself, not only for the device

I2C-bus and I/O initial states, but also to load specific pre-defined data or calibration data

into its operational registers. The power-up sequence should occur correctly with a fast

ramp rate and the I2C-bus active. The SE97B might not respond immediately after

power-up, but it should not damage the part if the power-up sequence is abnormal. If the

SCL line is held LOW, the part will not exit the power-on reset mode since the part is held

in reset until SCL is released.

ΔT56

3.6

0.4

()

0.4

()

0.4

()

[]

°C W 3.04 mW

0.17

°C

⁄

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