V

IN

V

OUT

GND

L

C

IN

C

OUT

R1

R2

C

FF

7.19 mm

5.08 mm

3.81 mm

2.54 mm

TPS62060

SLVSA95 – MARCH 2010

www.ti.com

LAYOUT CONSIDERATIONS

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Figure 24. PCB Layout

As for all switching power supplies, the layout is an important step in the design. Proper function of the device

demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If

the layout is not carefully done, the regulator could show poor line and/or load regulation, stability issues as well

as EMI and thermal problems. It is critical to provide a low inductance, impedance ground path. Therefore, use

wide and short traces for the main current paths. The input capacitor should be placed as close as possible to

the IC pins as well as the inductor and output capacitor.

Connect the AGND and PGND Pins of the device to the PowerPAD™ land of the PCB and use this pad as a star

point. Use a common Power PGND node and a different node for the Signal AGND to minimize the effects of

ground noise. The FB divider network should be connected right to the output capacitor and the FB line must be

routed away from noisy components and traces (e.g., SW line).

Due to the small package of this converter and the overall small solution size the thermal performance of the

PCB layout is important. To get a good thermal performance a four or more Layer PCB design is recommended.

The PowerPAD of the IC must be soldered on the power pad area on the PCB to get a proper thermal

connection. For good thermal performance the PowerPAD on the PCB needs to be connected to an inner GND

plane with sufficient via connections. Please refer to the documentation of the evaluation kit.

18

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