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BGU7003 Datasheet(PDF) 3 Page - NXP Semiconductors |
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BGU7003 Datasheet(HTML) 3 Page - NXP Semiconductors |
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3 / 17 page ![]() BGU7003_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 2 March 2009 3 of 17 NXP Semiconductors BGU7003 Wideband silicon germanium low-noise amplifier MMIC 5. Limiting values [1] Tsp is the temperature at the solder point of the ground lead. 6. Thermal characteristics 7. Characteristics [1] ICC(tot) = ICC + IRF_OUT + IR_BIAS. [2] Guaranteed by design and characterization. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage RF input AC coupled - 3.0 V ICC(tot) total supply current configurable with external resistor - 25 mA Ptot total power dissipation Tsp ≤ 103 °C [1] -70 mW Tstg storage temperature −65 +150 °C Tj junction temperature - 150 °C Table 6. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-sp) thermal resistance from junction to solder point 235 K/W Table 7. Characteristics Tamb =25 °C; VCC = 2.5 V; ICC(tot) = 5.0 mA; VENABLE ≥ 0.7 V unless otherwise specified. All measurements done on characterization board without matching, de-embedded up to the pins. Symbol Parameter Conditions Min Typ Max Unit VCC supply voltage RF input AC coupled 2.2 - 2.85 V ICC(tot) total supply current configurable with external resistor [1] 3 - 15 mA VENABLE ≤ 0.4 V [1] - - 0.001 mA Tamb ambient temperature −40 +25 +85 °C |s21|2 insertion power gain Tamb = 25 °C f = 1.575 GHz 16.0 17.5 - dB f = 2.4 GHz [2] 14.0 15.2 - dB f = 5.8 GHz [2] 10.0 11.4 - dB −40 °C ≤ Tamb ≤ 85 °C f = 1.575 GHz [2] 15.0 17.5 - dB f = 2.4 GHz [2] 13.0 15.2 - dB f = 5.8 GHz [2] 9.0 11.4 - dB MSG maximum stable gain f = 1.575 GHz - 20.5 - dB f = 2.4 GHz - 17.8 - dB f = 5.8 GHz - 15.4 - dB NFmin minimum noise figure f = 1.575 GHz - 0.70 - dB f = 2.4 GHz - 0.80 - dB f = 5.8 GHz - 1.5 - dB |
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