BGU7003_1

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 01 — 2 March 2009

9 of 17

NXP Semiconductors

BGU7003

Wideband silicon germanium low-noise amplifier MMIC

8.2 Application board layout

Figure 11 shows the board layout with component identifications.

8.3 Printed-Circuit Board

The material that has been used for the evaluation board is FR4 using the stack shown in

Figure 12.

Fig 11. Printed-Circuit Board (PCB) of the BGU7003 evaluation board

001aaj664

BGU7003

X2

X1

X3

Semiconductors

Rb

Vcc

Ven

GND

L1

L2

C1

R3

R2

C3

R1

L4

C2

L3

Material supplier is ISOLA DURAVER;

ε

Fig 12. Stack of the PCB material

001aaj688

35

µm Cu

0.2 mm FR4 critical

0.8 mm FR4 only for

mechanical rigidity of PCB

35

µm Cu

35

µm Cu