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BGU7003 Datasheet(PDF) 15 Page - NXP Semiconductors |
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BGU7003 Datasheet(HTML) 15 Page - NXP Semiconductors |
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15 / 17 page  BGU7003_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 01 — 2 March 2009 15 of 17 NXP Semiconductors BGU7003 Wideband silicon germanium low-noise amplifier MMIC 10. Soldering 11. Abbreviations 12. Revision history Reflow soldering is the only recommended soldering method. Fig 24. Reflow soldering footprint sot891_fr solder resist occupied area solder land plus solder paste Dimensions in mm 0.25 (6 ×) 0.15 (6 ×) 0.5 (6 ×) 0.6 (6 ×) 0.7 0.35 1.4 1.05 Table 11. Abbreviations Acronym Description AC Alternating Current CDMA Code Division Multiple Access DC Direct Current FR4 Flame Retardant 4 GPS Global Positioning System LNA Low-Noise Amplifier MMIC Monolithic Microwave Integrated Circuit RF Radio Frequency SiGe:C Silicon Germanium Carbon SMA SubMiniature version A WLAN Wireless Local Area Network Table 12. Revision history Document ID Release date Data sheet status Change notice Supersedes BGU7003_1 20090302 Product data sheet - - |
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