81341 datasheet(69/89 Pages) INTEL

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Intel® 81341 and 81342 I/O Processors

December 2007

Datasheet

Order Number: 315039-003US

Electrical Specifications—Intel® 81341 and 81342

4.2

Targeted DC Specifications

Table 18. DC Characteristics

Symbol

Parameter

Minimum

Maximum

Unit

Notes

VIL1

Input Low Voltage (General Purpose).

-0.3

0.3VCC3P3

VIH1

Input High Voltage (General Purpose).

2.0

VCC3P3 + 0.3

VIL2

Input Low Voltage (PCI).

-0.5

0.3VCC3P3

VIL3

Input Low Voltage (PCI-X).

-0.5

0.35VCC3P3

VIH3

Input High Voltage (PCI-X/PCI).

0.5VCC3P3

VCC3P3 + 0.5

VIL4

Input Low Voltage (DDR2 SDRAM).

-0.3

M_VREF - 0.125

VIH4

Input High Voltage (DDR2 SDRAM).

M_VREF + 0.125

VCC1P8 + 0.3

VOL1

Output Low Voltage (General Purpose).

–

0.4

IOL = 10 mA

VOH1

Output High Voltage (General Purpose).

2.6

–

IOH = -10 mA

VOL2

Output Low Voltage (PCI-X).

–

0.1VCC3P3

IOL = 1.50 mA

VOH2

Output High Voltage (PCI-X).

0.9VCC3P3

–V

IOH = -0.50 mA

VOL3

Output Low Voltage

(DDR2 SDRAM driver set to 21

Ω).

0.28

IOL = 11 mA

VOH3

Output High Voltage

(DDR2 SDRAM driver set to 21

Ω).

1.42

IOH = -11 mA

VOL4

Output Low Voltage

(DDR2 SDRAM driver set to 50

Ω).

0.28

IOL = 5 mA

VOH4

Output High Voltage

(DDR2 SDRAM driver set to 50

Ω).

1.42

IOH = -5 mA

ILI1

Input Leakage Current for General Purpose

pins when internal pull up resistors are not

enabled.

±5

0 ≤ VIN ≤ VCC3P3

ILI2

Input Leakage Current for PCI-X pins when

internal pull up resistors are not enabled.

±10

0 ≤ VIN ≤ VCC3P3 (Cat . 2)

0 ≤ VIN ≤ VCCVIO (Cat. 1)

ILI3

Input Leakage Current for DDR2 pins when

internal pull up resistors are not enabled.

±2

A 0 ≤ VIN ≤ VCC1P8

RGP

Internal pull up resistor value for General

Purpose pins.

28.5

38.7

ΚΩ

RPCIX

Internal pull up resistor value for PCI-X pins.

5.9

8.1

ΚΩ

CGP

General Purpose pin Capacitance.

4.5

CPCIX

PCI-X pin Capacitance.

4.5

CDDR2

DDR2 pin Capacitance.

4.5

LPIN

Ball Inductance.

112

Notes:

Not tested, guaranteed by design.

General Purpose signals include all signals that are not part of the DDR2, PCI-X and PCI-Express interfaces and analog

pins.

Input leakage currents include hi-Z output leakage for all bi-directional buffers with tri-state outputs.

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