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R27 Datasheet(PDF) 20 Page - Renesas Technology Corp |
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R27 Datasheet(HTML) 20 Page - Renesas Technology Corp |
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20 / 487 page  Rev.2.10 Sep 26, 2008 Page 1 of 453 REJ09B0278-0210 R8C/26 Group, R8C/27 Group SINGLE-CHIP 16-BIT CMOS MCU 1. Overview These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same. 1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer products, automotive, etc. REJ09B0278-0210 Rev.2.10 Sep 26, 2008 |
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