PCF2123 datasheet(60/63 Pages) NXP

60 / 63 page

PCF2123

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Product data sheet

Rev. 5 — 27 April 2011

60 of 63

NXP Semiconductors

PCF2123

SPI Real time clock/calendar

22. References

[1]

AN10365 — Surface mount reflow soldering description

[2]

AN10366 — HVQFN application information

[3]

AN10706 — Handling bare die

[4]

AN10853 — Handling precautions of ESD sensitive devices

[5]

IEC 60134 — Rating systems for electronic tubes and valves and analogous

semiconductor devices

[6]

IEC 61340-5 — Protection of electronic devices from electrostatic phenomena

[7]

IPC/JEDEC J-STD-020D — Moisture/Reflow Sensitivity Classification for

Nonhermetic Solid State Surface Mount Devices

[8]

JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body

Model (HBM)

[9]

JESD78 — IC Latch-Up Test

[10] JESD625-A — Requirements for Handling Electrostatic-Discharge-Sensitive

(ESDS) Devices

[11] NX3-00092 — NXP store and transport requirements

[12] SNV-FA-01-02 — Marking Formats Integrated Circuits

23. Revision history

Table 54.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

PCF2123 v.5

20110427

Product data sheet

PCF2123 v.4

Modifications:

• Added product type PCF2123U/5GA/1

• Adjusted the bare die outline drawings

• Added 3d package drawings

• Added footprint information

PCF2123 v.4

20101222

Product data sheet

PCF2123 v.3

20101005

Product data sheet

PCF2123_2

20091204

Product data sheet

PCF2123_1

20081119

Product data sheet

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