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PCF8523 Datasheet(PDF) 47 Page - NXP Semiconductors

Part # PCF8523
Description  Real-Time Clock (RTC) and calendar
PDF  66 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8523 Datasheet(HTML) 47 Page - NXP Semiconductors

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PCF8523
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Product data sheet
Rev. 3 — 30 March 2011
47 of 66
NXP Semiconductors
PCF8523
Real-Time Clock (RTC) and calendar
10. Limiting values
[1]
Pass level; Human Body Model (HBM), according to Ref. 6 “JESD22-A114”.
[2]
Pass level; Charged-Device Model (CDM), according to Ref. 7 “JESD22-C101”.
[3]
Pass level; latch-up testing according to Ref. 8 “JESD78” at maximum ambient temperature (Tamb(max)).
[4]
According to the NXP store and transport requirements (see Ref. 10 “NX3-00092”) the devices have to be
stored at a temperature of +8
C to +45 C and a humidity of 25 % to 75 %. For long-term storage products,
deviant conditions are described in that document.
Table 45.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
0.5
+6.5
V
IDD
supply current
50
+50
mA
VI
input voltage
0.5
+6.5
V
VO
output voltage
0.5
+6.5
V
II
input current
10
+10
mA
IO
output current
10
+10
mA
VBAT
battery supply voltage
0.5
+6.5
V
Ptot
total power dissipation
-
300
mW
VESD
electrostatic discharge voltage
HBM
[1] -
2000 V
CDM
[2] -
1500 V
Ilu
latch-up current
[3] -100
mA
Tstg
storage temperature
[4]
65
+150
C
Tamb
ambient temperature
operating device
40
+85
C



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